色悠久久久久久久综合网伊人,日本卡一卡二卡乱码三卡四码 ,国产无吗一区二区三区在线欢,国产av丝袜旗袍无码网站

Your Position: Home > Support > Service Center

Microsoft joined a new generation of DRAM groups of HMCC reason

2012/8/16??????view:

  In May 8, 2012, promote the use of TSV ( TSV ) 3D laminated to a new generation of DRAM " Hybrid Memory Cube ( HMC ) Hybrid Memory Cube Consortium " popularity ( HMCC ) announced that the United States, software giant Microsoft has joined the association.

  HMC is the three-dimensional structure, the logic chip along the vertical direction superposition of multiple DRAM chips, and then through the TSV connection wiring technology. HMC 's biggest characteristic is compared with existing DRAM, performance can be greatly improved. The reasons there are two, one is between chips from semiconductor package wiring distance on a board on the traditional methods of " cm " units are substantially reduced to dozens ofμ m~ 1mm; two is on a chip to form 1000 to tens of thousands of TSV, realize the multipoint connection chip.

  Microsoft 's accession to the HMCC, because we are considering how to corresponding is likely to become a personal computer and a computer to improving the performance of " memory bottleneck " problem. Memory bottleneck refers to as the microprocessor performance through multiple nucleation and constantly improve, the architecture of the DRAM performance will not be able to meet the need of processor. If do not solve this problem, can occur even if the computer new product, the actual performance is also not appropriate promotion situation. Compared with it, if the TSV based on the application of HMC in computer main memory, the data transmission speed can be increased to the current DRAM is about 15 times, therefore, is not just a giant Microsoft, American companies such as Intel are also active in research using HMC.

  In fact, plans to use TSV not only for HMC and other DRAM products. According to the semiconductor manufacturers plan, in the next few years, borne from electronic equipment input function of the CMOS sensor to the responsible for the operations of FPGA and multi core processor, and in charge of product storage of DRAM and NAND flash will have to import TSV. If the plan goes ahead, TSV will assume the input, operation, storage and other electronic equipment main function.

国产精品麻豆欧美日韩ww| 日韩日韩日韩日韩日韩| 丝袜人妻一区二区三区| 久久av高潮av无码av| 日韩人妻无码专区精品| 少妇粉嫩小泬喷水视频www| 中文字幕人妻无码一区二区三区| 国产午夜无码片在线观看| 国产精品久久久亚洲| 在教室伦流澡到高潮hnp| 国产精品 无码专区| 日韩精品无码中文字幕电影 | 国产精品扒开腿做爽爽爽视频| 国产精品三级一区二区| 国产高清在线精品一区二区三区| av无码中文字幕不卡一区二区三区| 性色生活片在线观看| 久久er99热精品一区二区 | 精品人妻系列无码一区二区三区 | 国产精品扒开腿做爽爽爽视频| 四虎亚洲精品成人a在线观看| 国产欧美亚洲精品a第一页| 亚洲日韩国产精品乱-久| 日韩国产成人无码av毛片| 国产午夜精品一区二区三区漫画| 男女裸体影院高潮| 亚洲熟女乱色一区二区三区| 国产 麻豆 日韩 欧美 久久 | 日日摸日日碰夜夜爽无码| 色妺妺视频网| 国产丝袜无码一区二区三区视频| 亚洲国产精品第一区二区| 亚洲av色香蕉一区二区| 狠狠人妻久久久久久综合| 日本伊人精品一区二区三区 | 亚洲日韩精品无码一区二区三区| 麻豆一区二区三区蜜桃免费| 亚洲乱码国产乱码精华| 国产亚洲人成在线播放| 99热久久这里只精品国产www| 少妇高潮惨叫久久久久久电影|